TenderHub

Wirebond removal for BGA packaged semiconductor chips

ActiveGovernment e-Marketplace (GeM)

Tender / Bid Number: GEM/2026/B/7936231

Department of Electronics and Information TechnologyElectrical Components & Cables
Tender Overview
Tender ID
GEM/2026/B/7936231
Reference Number
GEM/2026/B/7936231
Organisation
Department of Electronics and Information Technology
Department
Ministry of Electronics and Information Technology
Category
Electrical Components & Cables
Estimated Value
Not specified
EMD
Not specified
Tender Fee
Not specified
Published Date
19 Aug 2026
Closing Date
Closing: 01 Sep 2026
Description

Wirebond removal for BGA packaged semiconductor chips

Requirements / Eligibility

Detailed eligibility and requirement information is available in the official tender documents. Please click View Official Tender to verify the latest requirements on the official source.