Lan Connectors,Lan Wire,Power cable,RAM DDR 3,Thermal Compound Paste Use in Coolers Heat Sink for C

ActiveGovernment e-Marketplace (GeM)

Tender / Bid Number: GEM/2026/B/7937132

AI Airport Services LimitedElectrical Components & Cables

Tender Overview

Tender ID: GEM/2026/B/7937132
Reference Number: GEM/2026/B/7937132
Organisation: AI Airport Services Limited
Department: Ministry of Civil Aviation
Category: Electrical Components & Cables
Estimated Value: Not specified
EMD: Not specified
Tender Fee: Not specified
Published Date: 19 Aug 2026
Closing Date: Closing: 29 Aug 2026

Description

Lan Connectors,Lan Connectors,Lan Connectors,Lan Connectors,Lan Connectors,Lan Wire,Lan Wire,Lan Wire,Lan Wire,Lan Wire,Power cable,Power cable,Power cable,Power cable,Power cable,RAM DDR 3,RAM DDR 3,RAM DDR 3,RAM DDR 3,RAM DDR 3,Thermal Compound Paste Use in Coolers Heat Sink for CPU and Chip-sets,Thermal Compound Paste Use in Coolers Heat Sink for CPU and Chip-sets,Thermal Compound Paste Use in Coolers Heat Sink for CPU and Chip-sets,Thermal Compound Paste Use in Coolers Heat Sink for CPU and Chip-sets,Thermal Compound Paste Use in Coolers Heat Sink for CPU and Chip-sets

Documents

Bid Document (PDF)

bid_document

Requirements / Eligibility

Detailed eligibility and requirement information is available in the official tender documents. Please click View Official Tender to verify the latest requirements on the official source.